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RUILON RL0603N503F4150FTF

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RUILON RL0603N503F4150FTF

Resistance @ 25℃ : 50kΩ

Power(Watts) : 100mW

Pitch : -

Operating Temperature : -40℃~+125℃

B Constant (25℃/100℃) : -

Tolerance : ±1%

Steady State Current (Max) : 130uA

Diameter (φD) : -

Thermal Time Constant : 5s

B Constant (25℃/85℃) : 4209K

B Constant (25℃/75℃) : -

B Constant Tolerance : ±1%

B Constant (25℃/50℃) : 4150K

Description : NTC Thermistor 50kΩ Surface Mount 0603

Mfr. Part # : RL0603N503F4150FTF

Model Number : RL0603N503F4150FTF

Package : 0603

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Product Overview

Dissipation Factor: The required power which makes the NTC thermistor body temperature raise 1C through self-heated, normally expressed in milliwatts per degree Celsius (mW/C). It can be calculated by the following formula: 5 = X / (T - To), where X is the necessary electric power and (T-To) is the temperature rise.

Rated Power: The necessary electric power that makes the thermistor's temperature rise 100C by self-heating at an ambient temperature of 25C.

Permissible operating current: The current that keeps the body temperature of a chip NTC on the PC board in still air rising 1C by self-heating.

Notes on Rated Power: When Rated Electric Power (100mW) is applied to an NTC thermistor at 25C in still air, the temperature rise of the NTC thermistor is about 100C. However, too rapid temperature rise may cause unexpected failures. Do not apply more than 10mW of electric power in a short time (10mW of power will increase the temperature by about 10C). A current less than 1/10 of the Permissible Operating Current value is recommended to prevent self-heating.

Brand RUILS2N

Item	Standard Test Methods and Remarks	Requirements
Terminal Strength	IEC 60068-2-21 Solder the chip to the testing jig (glass epoxy board) using eutectic solder. Then apply a force in the direction of the arrow.	No removal or split of the termination or other defects shall occur.
	IEC 60068-2-21 R~ Size F {45 0F ) Duration	0201: 5N 10+1s 0402, 0603: 5N 10+1s 0805: 10N
Resistance to Flexure	IEC 60068-2-21 Solder the chip to the test jig (glass epoxy board) using a eutectic solder. Then apply a force in the direction shown as follow.	No visible damage.
	Pressurizing Speed 0201, 1mm 0402, 0603, 0805 2mm	<0.5mm/s 10s
Vibration	IEC 60068-2-80 Solder the chip to the testing jig (glass epoxy board) using eutectic solder. The chip shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz.	No visible damage. AR25/R25 2%
	Frequency range: 10Hz55Hz10Hz 53R, BHIHN 1 48, E50 The frequency ranges from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
Dropping	IEC 60068-2-32 Drop a chip 10 times on a concrete floor from a height of 1 meter.	No visible damage.
Solderability	IEC 60068-2-58 Solder temperature: 2455C. Duration: 30.3s. Solder: 96.5wt%Sn/3.0wt%Ag/0.5wt%Cu Flux: 25% Rosin and 75% ethanol in weight.	Wetting coverage shall exceed 95%.
Resistance to Soldering Heat	IEC 60068-2-58 Solder temperature: 2605C. Duration: 101s. Solder: 96.5wt%Sn/3.0wt%Ag/0.5wt%Cu Flux: 25% Rosin and 75% ethanol in weight.	No visible damage. AR25/R25 < 2% R/R < 1%

Recommended Soldering Technologies	Profile	Solder	Flux	Notes
Re-flowing Profile	Ramp: 1~2C/sec. Pre-heating: 150~170C/90+30 sec. Time above 240C: 20~40 sec. Peak temperature: 260C Max./10 sec.	96.5wt%Sn/3.0wt%Ag/0.5wt%Cu	Rosin type flux	Max.2 times for re-flowing. Total accumulated soldering time at peak temperature within 30sec. Cooling: Gradual cooling in air.
Iron Soldering Profile	Iron soldering power: Max.20W Pre-heating: 150C/60sec. Soldering Tip temperature: 280 C Max. Soldering time: 3 sec Max.	96.5wt%Sn/3.0wt%Ag/0.5wt%Cu	Rosin type flux	Max.1 time for iron soldering.

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