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Comprehensive data on ROHM BDJ0800HFV-TR HVSOF5 SOP package pin count weight and packing materials specifications

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Comprehensive data on ROHM BDJ0800HFV-TR HVSOF5 SOP package pin count weight and packing materials specifications

Description : HVSOF-5 Thermostats - Solid State RoHS

Mfr. Part # : BDJ0800HFV-TR

Model Number : BDJ0800HFV-TR

Package : HVSOF-5

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Package Information: HVSOF5

This document provides detailed package information for the HVSOF5 package, including its structure, packing specifications, dimensions, marking, storage conditions, and soldering recommendations. It is intended for use in general electronic equipment.

Product Attributes

Brand: ROHM
Package Name: HVSOF5
Package Type: SOP
Lead Finish: Pure Tin
MSL Level: 1

Technical Specifications

Category	Specification	Details
Package	Pin Count	5
Package	Weight	0.003 g
Packing	Form	Tape&Reel
Packing	Quantity	3,000 pcs
Packing Material	Embossed carrier tape	PS
Packing Material	Cover tape	PET+PE
Packing Material	Reel	PS
Packing Material	Unit box	Cardboard
Packing Material	Shipping box	Cardboard
Packing Specification	Leader length	No component pockets are 160mm or more.
Packing Specification	Trailer length	No component pockets are 40 mm or more. Tape is free from reel.
Packing Specification	Cover tape peelback strength	0.2 N to 0.7 N
Packing Specification	Missing ICs	No consecutive dropouts. A maximum of 0.1% of specified number of products in each packing may be missing.
Reel Dimensions	A	180 +0/-1.5 mm
Reel Dimensions	B	60 +1.0/-0 mm
Reel Dimensions	C	13 0.2 mm
Reel Dimensions	D	21 0.8 mm
Reel Dimensions	E	2 0.5 mm
Reel Dimensions	W1	9 +1.0/-0 mm
Reel Dimensions	W2	11.4 1.0 mm
Packing Method	Unit box per reel	3 reel(s) or less per unit box
Packing Style	Unit box per shipping box	4 unit boxes or less per shipping box
Shipping Box Dimensions	X	190 mm
Shipping Box Dimensions	Y	255 mm
Shipping Box Dimensions	Z	193 mm
Storage Conditions	Temperature	5 to 30 C
Storage Conditions	Humidity	- to 85 % RH
Storage Conditions	Storage Period	- to 1 year
Soldering Conditions	Reflow Profile	Recommended temperature profile for reflow
Soldering Conditions	Wave Soldering	Not supported
Soldering Conditions	Solder Iron Rework	Not allowed (may cause mold crack and terminal open)
Mounting Cautions	Flexible Film Mounting	Film bend may occur; usage of support board and underfill is recommended.
Mounting Cautions	Long/Narrow Board Mounting	Bending stress may occur; bending board direction and outer lead direction is recommended as drawing (vertically layout) and under fill usage is recommended.

2311142236_ROHM-BDJ0800HFV-TR_C17383133.pdf

Comprehensive data on ROHM BDJ0800HFV-TR HVSOF5 SOP package pin count weight and packing materials specifications Images

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