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Encapsulated surface mount thermistor STE SMDNTC3225N05004MK0 compatible with lead free reflow and wave soldering

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Encapsulated surface mount thermistor STE SMDNTC3225N05004MK0 compatible with lead free reflow and wave soldering

Operating Temperature : -40℃~+175℃

Description : SMD,8.1x6mm NTC Thermistors RoHS

Mfr. Part # : SMDNTC3225N05004MK0

Model Number : SMDNTC3225N05004MK0

Package : SMD,8.1x6mm

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Product Overview

The SMD-3225 Series is a series of encapsulated surface-mount thermistors designed for circuit protection and various electronic applications. Featuring advanced encapsulation technology with UL94-V0 rated materials, these thermistors offer a compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape and reel packaging, compatible with lead-free reflow and wave soldering processes for automated assembly.

Product Attributes

  • Brand: Songtian ()
  • Product Type: Encapsulated Surface Mount Thermistor
  • Series: SMD-3225
  • NTC Type: Negative Temperature Coefficient
  • Encapsulation Material: UL94-V0 rated
  • Packaging: SMD Tape and Reel
  • Soldering Compatibility: Lead-free Reflow/Wave Soldering
  • Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.

Technical Specifications

Model Nominal Zero-Power Resistance @25 () Max. Steady State Current @25 (A) Max. Residual Resistance under Max. Steady State Current @25 () B Value (K) 10% Thermal Time Constant (S) Thermal Dissipation Coefficient (mW/) Operating Temperature Range ()
SMDNTC3225*1R505** 1.5 5 0.065 2600 <43 >13 -40175
SMDNTC3225*02005** 2 5 0.085 2600 <43 >13 -40175
SMDNTC3225*2R505** 2.5 5 0.095 2600 <43 >13 -40175
SMDNTC3225*03005** 3 5 0.100 2600 <43 >13 -40175
SMDNTC3225*04004** 4 4 0.150 2600 <44 >13 -40175
SMDNTC3225*05004** 5 4 0.156 2800 <45 >13 -40175
SMDNTC3225*06003** 6 3 0.240 2800 <45 >13 -40175
SMDNTC3225*6R803** 6.8 3 0.245 2800 <45 >13 -40175
SMDNTC3225*07003** 7 3 0.2824 2800 <45 >13 -40175
SMDNTC3225*08003** 8 3 0.255 2800 <47 >14 -40175
SMDNTC3225*10003** 10 3 0.275 2800 <47 >14 -40175
SMDNTC3225*12002** 12 2 0.462 2800 <48 >14 -40175
SMDNTC3225*13002** 13 2 0.465 2800 <50 >14 -40175
SMDNTC3225*15002** 15 2 0.468 2800 <50 >14 -40175
SMDNTC3225*16002** 16 2 0.470 2800 <50 >14 -40175
SMDNTC3225*18002** 18 2 0.495 3000 <52 >15 -40175
SMDNTC3225*20002** 20 2 0.512 3000 <52 >15 -40175
SMDNTC3225*22002** 22 2 0.563 3000 <52 >15 -40175
SMDNTC3225*25002** 25 2 0.623 3000 <52 >15 -40175
SMDNTC3225*300S5** 30 1.5 0.667 3000 <52 >15 -40175
SMDNTC3225*330S5** 33 1.5 0.734 3000 <52 >15 -40175
SMDNTC3225*470S5** 47 1.5 1.002 3000 <52 >15 -40175
SMDNTC3225*500S5** 50 1.5 1.021 3000 <52 >15 -40175
SMDNTC3225*600S5** 60 1.5 1.215 3000 <52 >15 -40175
SMDNTC3225*800S2** 80 1.2 1.656 3200 <52 >15 -40175
SMDNTC3225*101S1** 100 1.1 2.053 3200 <50 >15 -40175
SMDNTC3225*121S1** 120 1.1 2.253 3200 <50 >15 -40175
SMDNTC3225*20101** 200 1 4.121 3200 <50 >13 -40175

Dimensions

Footprint W: External Fold

Dimension Value (mm)
L 8.1 0.3
L1 10.0 0.3
W 6.0 0.3
L2 11.4 0.3
H 2.5 0.3
L3 0.5 0.3
W1 2.5 0.3
T 0.15 0.01

Pad Dimensions (External Fold)

Dimension Value (mm)
a 10.0 0.2
b 2.2 0.2
c 3.6 0.2

Footprint N: Internal Fold

Dimension Value (mm)
L 8.1 0.3
L1 8.5 0.3
W 6.0 0.3
L2 6.0 Min
H 2.5 0.3
L3 1.1 0.3
W1 2.5 0.3

Pad Dimensions (Internal Fold)

Dimension Value (mm)
a 5.7 0.2
b 1.65 0.2
c 3.0 0.2

Applications

  • Circuit Protection
  • Industrial Equipment
  • Communication Equipment
  • Consumer Electronics
  • Automotive Electronics

Part Numbering Principle

SMD NTC 3225 N 2R5 05 M 0

  • NTC: Negative Temperature Coefficient Thermistor
  • Internal Management Code
  • Model: SMD
  • Size: 3225 (approx. 8.1*6.0mm)
  • Foot Shape: N (Internal Fold), W (External Fold)
  • Zero-Power Resistance @25: 020 (2.0), 2R5 (2.5), 201 (200)
  • Max. Steady State Current: S5 (1.5A), 05 (5.0A)
  • Resistance Tolerance: L (15%), M (20%)

Product Marking (Example)

1. Songtian Logo 2. NTC (Negative Temperature Coefficient Thermistor) 3. 3225 (Size: approx. 8.1*6.0mm) 4. 050 (Zero-Power Resistance @25: 5.0) 5. M (Capacity Tolerance: M (20%))

Reliability Testing

No. Item Test Method Standard Resistance Change Rate
1 Vibration Frequency: 10~55Hz, Amplitude: 0.75mm, Direction & Time: X, Y, Z axes each 2 hours No visible damage 10%
2 Solderability Temperature: 2455, Time: 30.5s Uniform tinning and area 95% -
3 Resistance to Soldering Heat Immerse product leads in 2605 solder liquid for 101 seconds, then remove. - 10%
4 High Temperature Storage Stored at 1252 for 1000+48 hours, tested after 2 hours static state. - 20%
5 Moisture Resistance 1. Stored at 402, 90-95% humidity for 1000 hours.
2. Stored at 402, 90-95% humidity with 1/20 of max. dissipation voltage (not less than 0.5V) for 500 hours.		 - 20%
6 Thermal Shock -4030min 255min 12530min 255min, 5 cycles. - 20%
7 Endurance Test 1. 255, Imax, 1000h;
2. 255, Imax, (1min ON /5min OFF)*1000 cycles.		 No visible damage 20%
8 Insulation Withstand Voltage Apply 750Vac voltage for 1 minute between leads and a tightly wound metal wire coil on the product surface. No external damage -

Packaging Information

Tape Packaging Specification (Unit: mm)

SPEC N (Internal Fold) W (External Fold)
A0B0K0PP0P2T A0B0K0PP0P2T
Dimensions 6.350.18.450.13.250.18.00.14.00.12.00.10.30.05 6.160.111.900.153.100.18.00.154.00.152.00.150.30.05

Tape Reel Dimensions (Unit: mm)

SPEC N (Internal Fold) W (External Fold)
WEFD0D1 WEFD0D1
Dimensions 16.00.31.750.17.50.11.5+0.1/-01.5+0.1/-0 24.00.31.750.1511.50.151.5+0.15/-01.5+0.15/-0
Components/Reel 4000pcs

15-inch Reel Dimensions (Unit: mm)

SPEC N (Internal Fold) W (External Fold)
E0.5F0.5W0.2T10.3T20.3 E0.5F0.5W0.2T10.3T20.3
Dimensions 2.310.7516.42.22.2 2.310.7524.42.22.2
A+0/-2 380 380
N3.0 100 100
D0.3 13.3 13.3

Soldering Instructions

Lead-Free Reflow Soldering Curve

When reflow soldering, it should be performed under the following conditions:

  • Soldering Temperature: 230260
  • Soldering Time: 1030s
  • Preheating Temperature: 170 max.

Wave Soldering Curve

(Curve data not provided in source text)

Soldering Iron Rework Conditions

Item Condition
Soldering Iron Tip Temperature 400 (max.)
Soldering Time 3.5 sec (max.)
Soldering Iron Power 50W (max.)

Storage Environment

  • Store products under the following conditions and use within 6 months after delivery.
  • Temperature: 10~30, Relative Humidity: 60% max.
  • Solder NTC within 168 hours after opening the moisture-proof packaging. After opening, store the NTC in the moisture-proof packaging with desiccant and HIC card, maintaining the above conditions.
  • If the storage period exceeds 6 months, or the indicator color of the accompanying HIC card changes after opening, baking (60 *168hr) is required before soldering.
  • Reference data for baking when product exposure time exceeds shelf life or when ambient temperature/humidity exceeds requirements (shelf life restarts after baking).
  • Do not store products in corrosive substances such as sulfur, chlorine gas, or acid, as this may cause lead oxidation and reduce solderability.
  • To avoid influence from moisture, dust, etc., products should be stored on shelves.
  • Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.

Usage Precautions

  • The operating ambient temperature should be within the specified range of technical conditions.
  • Do not install near heat-generating or combustible components; maintain a gap of more than 3mm to avoid damaging the component.
  • Wear gloves when handling leads.
  • This specification guarantees the quality of our product as an individual component. When our product is installed in your product, please ensure that your product has been effectively evaluated and confirmed according to your company's specifications.
  • If your company's trial use of our product exceeds the product functions defined by this test specification, we will not be responsible for any resulting failures.
  • When an NTC is damaged, the failure may result in a short circuit. To prevent dangerous situations such as overheating, smoke, or fire during a short circuit, use components like fuses in the circuit to implement a fail-safe function.

2508261540_STE-SMDNTC3225N05004MK0_C50751512.pdf


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